{"id":170,"date":"2014-09-17T14:14:12","date_gmt":"2014-09-17T12:14:12","guid":{"rendered":"https:\/\/webs.uab.cat\/gnam\/lab-tour\/"},"modified":"2022-11-21T17:48:18","modified_gmt":"2022-11-21T15:48:18","slug":"lab-tour","status":"publish","type":"page","link":"https:\/\/webs.uab.cat\/gtnam\/lab-tour\/","title":{"rendered":"Lab Tour"},"content":{"rendered":"\n<div class=\"wp-block-columns alignwide is-layout-flex wp-container-core-columns-is-layout-9d6595d7 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:33.33%\">\n<figure class=\"wp-block-image is-resized\"><img loading=\"lazy\" decoding=\"async\" src=\"http:\/\/grupsderecerca.uab.cat\/gnam\/sites\/grupsderecerca.uab.cat.gnam\/files\/images\/wirebonding_0.jpg\" alt=\"\" width=\"398\" height=\"428\" title=\"\"\/><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:66.66%\">\n<h3 class=\"wp-block-heading\">TPT manual thermosonic wire bonder HB05<\/h3>\n\n\n\n<p>This equipment is able to bond in three different modes (wedge, ball and bump bonding) for small scale production lines.<br>Technical specifications:<\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>Independent control of first and second bond parameters<\/li><li>For 17\u00b5m to 50\u00b5m wire and 25\u00b5m x 200\u00b5m ribbon<\/li><li>Bond head with deep-access (12 mm)<\/li><li>PLL ultrasonic generator<\/li><li>stitch bonding<\/li><li>Loop height adjustable<\/li><li>Bond arm length 165 mm<\/li><li>2\u201d wire spool<\/li><li>6:1 ratio X-Y manipulator<\/li><li>Dual fiber optic illuminator<\/li><\/ul>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-columns alignwide is-layout-flex wp-container-core-columns-is-layout-9d6595d7 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:33.33%\">\n<figure class=\"wp-block-image\"><img decoding=\"async\" src=\"http:\/\/grupsderecerca.uab.cat\/gnam\/sites\/grupsderecerca.uab.cat.gnam\/files\/images\/DSC.jpg\" alt=\"Perkin-Elmer DSC\" title=\"\"\/><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:66.66%\">\n<h3 class=\"wp-block-heading\">Differential scanning calorimeter Perkin Elmer DSC7<\/h3>\n\n\n\n<p>A DSC measures the amount of energy released or absorbed by a sample which is heated, cooled and kept at constant temperature. Combined with a measurement of the sample&#8217;s temperature, DSC provides a reliable measurement of phase transformations.<\/p>\n\n\n\n<p>The DSC7 of Perkin Elmer is a power compensation system, which measures directly the energy of the reaction and provides closer peaks and high sensitivity. The use of platinum resistance thermometers allows measuring with precision and repeatability. One of our DSC can work as a modulated DSC which allows greater resolution in the small thermal events, such as glass transitions.<\/p>\n\n\n\n<p>DSC7 Specifications:<\/p>\n\n\n\n<p>Calorimetric accuracy of less than 1% with less than 1 \u03bcW of sensitivity and precision of 0.1%. Temperature Range: -170\u00b0C to 723\u00b0C with 0.1\u00b0C accuracy and precision. Heating rates up to 300\u00b0C \/ min.<\/p>\n\n\n\n<p>It can be used in static or dynamic atmosphere of nitrogen, argon, helium, carbon dioxide, air, oxygen and other gases.<\/p>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-columns alignwide is-layout-flex wp-container-core-columns-is-layout-9d6595d7 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:33.33%\">\n<figure class=\"wp-block-image is-resized\"><img loading=\"lazy\" decoding=\"async\" src=\"http:\/\/grupsderecerca.uab.cat\/gnam\/sites\/grupsderecerca.uab.cat.gnam\/files\/images\/cryo.JPG\" alt=\"\" width=\"398\" height=\"493\" title=\"\"\/><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:66.66%\">\n<h3 class=\"wp-block-heading\"><br>Liquid helium cryostat measuring the thermal conductivity and the temperature coefficient of resistance (TCR)<\/h3>\n\n\n\n<p>3\u03c9 system for measuring the thermal conductivity in thin films. 3\u03c9 technique uses an alternating current for heating and a lock-in amplifier that directly measures the thermal conductivity of a conductor or dielectric, either bulk or thin layer. A small heating line set on the surface of the sample by photolithography works as both, heater and thermometer.<\/p>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-columns alignwide is-layout-flex wp-container-core-columns-is-layout-9d6595d7 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:33.33%\">\n<figure class=\"wp-block-image is-resized\"><img loading=\"lazy\" decoding=\"async\" src=\"http:\/\/grupsderecerca.uab.cat\/gnam\/sites\/grupsderecerca.uab.cat.gnam\/files\/images\/sputter1.jpg\" alt=\"Sputtering\" width=\"400\" height=\"316\" title=\"\"\/><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:66.66%\">\n<h3 class=\"wp-block-heading\">Sputtering<\/h3>\n\n\n\n<p>The equipment of thin film preparation uses the techniques of preparing DC sputtering and thermal evaporation. The equipment has 4 DC sputtering guns and two sources for thermal evaporation. Four different gas inputs make evaporations at reactive atmospheres possible and allows to obtain different compounds. It permits evaporation of metallic materials due to its 4 DC sources that work independently. With a pulsed source (pulsed DC) semiconductor materials as Si or Ge can be evaporated. The equipment is prepared to reach vacuum levels up to 3&#215;10<sup>-8<\/sup>mbar.<\/p>\n<\/div>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>TPT manual thermosonic wire bonder HB05 This equipment is able to bond in three different modes (wedge, ball and bump bonding) for small scale production lines.Technical specifications: Independent control of first and second bond parameters For 17\u00b5m to 50\u00b5m wire and 25\u00b5m x 200\u00b5m ribbon Bond head with deep-access (12 mm) PLL ultrasonic generator stitch [&hellip;]<\/p>\n","protected":false},"author":20,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-170","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/webs.uab.cat\/gtnam\/wp-json\/wp\/v2\/pages\/170","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/webs.uab.cat\/gtnam\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/webs.uab.cat\/gtnam\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/webs.uab.cat\/gtnam\/wp-json\/wp\/v2\/users\/20"}],"replies":[{"embeddable":true,"href":"https:\/\/webs.uab.cat\/gtnam\/wp-json\/wp\/v2\/comments?post=170"}],"version-history":[{"count":1,"href":"https:\/\/webs.uab.cat\/gtnam\/wp-json\/wp\/v2\/pages\/170\/revisions"}],"predecessor-version":[{"id":1210,"href":"https:\/\/webs.uab.cat\/gtnam\/wp-json\/wp\/v2\/pages\/170\/revisions\/1210"}],"wp:attachment":[{"href":"https:\/\/webs.uab.cat\/gtnam\/wp-json\/wp\/v2\/media?parent=170"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}