Authors J. Martín-Martínez, X. Aymerich, M. Nafría, and R. Rodríguez Citation Key 167 COinS Data Date Published 2009 Pagination 305-310 Journal IEEE Transactions on Device and Materials Reliability Volume 9 Year of Publication 2009 ← Channel Hot Carriers degradation and Bias Temperature Instabilities in CMOS inverters → Reversible dielectric breakdown in ultra Hf based high-k stacks under current limited stresses