Citation Key 172 COinS Data Issue 12 Journal IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control Volume 65 Year of Publication 2018 ← Fabrication and characterization of a hammer-shaped CMOS/BEOL-embedded nanoelectromechanical (NEM) relay → High Performance Seesaw Torsional CMOS-MEMS Relay Using Tungsten VIA Layer.